Tianhong Gu | 教职员工 | 澳门尼威斯人网站8311 (XJTLU)

Profile

Dr Tianhong Gu is presently an Assistant Professor in Materials Science and Engineering, the Department of Civil Engineering at Xi'an Jiaotong-Liverpool University (XJTLU). Previously she pursued the material research in the UK as a Research Associate (2018-2021) at Imperial College London and a Research Fellow (2021-2022) at University of Birmingham, with focus on material microstructure control & design, in-situ micromechanical testing & microstructural characterisation and materials modelling to develop cross-disciplinary solutions for the next generation high-performance and substantial-reliability engineering materials in aerospace, automotive, electronics and nuclear applications that aim to improve human life and environment for a low-carbon future. She is a specialist in understanding of micromechanical deformation, microstructure and for developing in-situ microscope methods and analysis.

Dr Gu graduated with M.Phil. in Materials Science and Metallurgy from University of Cambridge in 2014 and obtained a Ph.D. in Materials Science and Engineering from Imperial College London in 2018.

Qualifications
- Ph.D. in Materials Science and Engineering, Imperial College London, UK - 2018
- M.Phil. in Materials Science and Metallurgy (Downing College), University of Cambridge, UK - 2014
Experience
- Assistant Professor, Department of Civil engineering, Xi’an Jiaotong-Liverpool University, present
- Research Fellow, School of Metallurgy and Materials, University of Birmingham, 2021-2022
- Research Associate, Department of Materials, Imperial College London, 2018-2021
Research interests
- Mechanical behaviour and failure mechanism of materials
- Fatigue and fracture mechanics
- In-situ microscope and analysis (electron backscatter diffraction)
- Micromechanics and materials modelling
- Micro-deformation, microstructure and micro-crystallisation
- Materials engineering
Articles
- Tianhong Gu, Christopher M. Gourlay, and T. Ben Britton. "The role of lengthscale in the creep of Sn-3Ag-0.5 Cu solder microstructures." Journal of Electronic Materials 50 (2021): 926-938.
- Tianhong Gu, Vivian Tong, Christopher M. Gourlay, and T. Ben Britton. "In-situ study of creep in Sn-3Ag-0.5 Cu solder." Acta Materialia 196 (2020): 31-43.
- Tianhong Gu, Yilun Xu, Christopher M. Gourlay, and T. Ben Britton. "In-situ electron backscatter diffraction of thermal cycling in a single grain Cu/Sn-3Ag-0.5 Cu/Cu solder joint." Scripta Materialia 175 (2020): 55-60.
- Yilun Xu, *Tianhong Gu, Jingwei Xian, Finn Giuliani, T Ben Britton, Christopher Gourlay, Fionn Dunne. “Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder.” International Journal of Plasticity 137, (2021): 102904.
- Tianhong Gu, Christopher M. Gourlay, and T. Ben Britton. "Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5 Cu solder." Journal of Electronic Materials 48, no. 1 (2019): 107-121.
- James Dean, *T. Gu, and T. W. Clyne. "Evaluation of residual stress levels in plasma electrolytic oxidation coatings using a curvature method." Surface and Coatings Technology 269 (2015): 47-53.
Conference presentations
- TMS Conference & Exhibition - ‘Effect of content of intermetallic compounds on creep in controlled microstructure of tin-based solders’ at Anaheim, California, USA, 2022.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘The role of length-scale in the creep of Sn-3Ag-0.5Cu solder with controlled microstructure’, online, UK, 2021.
- The 19th International Conference on Textures of Materials (ICOTOM 19) - ‘In-situ observations of microstructure evolution and damage during creep of Pb-free solder’, Osaka, Japan, 2021.
- Sino-UK, Central Asia Forum and Lightweight Materials Seminar - 'Micromechanical Characterisation of Solder Alloys’, Nanjing, China, 2020.
- Oxford Micromechanics Group (OMG) - ‘Microstructure & Micromechanics of Solder Alloys’ at the University of Oxford, Oxford, UK, 2020.
- TMS Conference & Exhibition - ‘Micropillar Compression Test of Tin-solder microstructural units to reveal slip activities’ at Convention Centre, San Diego, USA, 2020.
- Engineering Alloys Seminar - ‘Microstructural evolution and damages of SAC305 solder alloys during creep and thermal cycling’ at Imperial College London, London, 2019.
- RMS Electron Backscatter Diffraction (EBSD) Conference -‘In-situ EBSD and FSD based observations of creep SAC305 solder’ at National Physical Laboratory (NPL), UK, 2019.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder’ at Sherwell Centre, University of Plymouth, UK, 2018.
- TMS Conference & Exhibition - ‘Evaluating creep deformation in controlled microstructures of Sn-3Ag-0.5Cu solder’ at Phoenix Convention Centre, USA, 2018.
- The National Student Conference in Metallic Materials - ‘Observations of microstructure evolution and damage during creep testing of Sn-3Ag-0.5Cu solder alloys’ at the Edge, Endcliffe Student Village, University of Sheffield, UK, 2017.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘In-situ observations of crystal orientation change and damage during thermal cycling of Pb-free solder joints’ at Lady Margaret Hall, University of Oxford, UK, 2017.
- RMS Electron Backscatter Diffraction (EBSD) Conference - ‘Observations of Microstructure Evolution and Damage of Solder Alloys during thermal and mechanical loading’ at Manchester Conference Centre, Manchester, UK, 2016.
Teaching activities
- Module leader for CEN412
- Module co-teaching for CEN425

Tianhong GuPh.D.

Profile

Qualifications

Experience

Research interests

Articles

Conference presentations

Teaching activities